TY  - JOUR

T1  - Microstructure transformation and mechanical properties of Al alloy joints soldered with Ni-Cu foam/Sn-3.0Ag-0.5Cu (SAC305) composite solder

JO  - Journal of Alloys and Compounds

PY  - 2022/07/01

AU  - Xiong C

AU  - Xiao Y

AU  - Zhang J

AU  - Luo D

AU  - Goodall R

ED  - 

DO  - DOI: 10.1016/j.jallcom.2022.166135

PB  - Elsevier BV

Y2  - 2024/09/20

ER  -