TY  - JOUR

T1  - Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

JO  - Journal of Alloys and Compounds

PY  - 2020/12/10

AU  - He H

AU  - Huang S

AU  - Ye Y

AU  - Xiao Y

AU  - Zhang Z

AU  - Li M

AU  - Goodall R

ED  - 

DO  - DOI: 10.1016/j.jallcom.2020.156240

PB  - Elsevier BV

VL  - 845

Y2  - 2024/09/20

ER  -