TY  - JOUR

T1  - Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam

JO  - Materials Letters

PY  - 2020/12/15

AU  - He H

AU  - Huang S

AU  - Xiao Y

AU  - Goodall R

ED  - 

DO  - DOI: 10.1016/j.matlet.2020.128642

PB  - Elsevier BV

VL  - 281

Y2  - 2024/09/20

ER  -