TY  - CONF

T1  - Modelling the enhancement to the thermal performance of encapsulants using thermally conductive filler materials

JO  - PCIM Asia Conference Proceedings

PY  - 2015/06/24

AU  - Hewitt D

AU  - Stone DA

AU  - Foster MP

ED  - 

PB  - Stuttgart, Germany; Mesago PCIM GmbH; [2014]

Y2  - 2024/09/19

ER  -