TY  - JOUR

T1  - Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

JO  - Materials Science and Engineering: A

UR  - http://eprints.whiterose.ac.uk/162494/

PY  - 2020/07/22

AU  - Xiao Y

AU  - Song Z

AU  - Li S

AU  - Li D

AU  - Zhang Z

AU  - Li M

AU  - Goodall R

ED  - 

DO  - DOI: 10.1016/j.msea.2020.139691

PB  - Elsevier BV

VL  - 791

Y2  - 2024/09/20

ER  -